EAI ADHIP 2020 will be held as a fully-fledged online conference.
Due to the safety concerns and travel restrictions caused by COVID-19, EAI ADHIP 2020 will take place online in a live stream.
Participants will still be able to enjoy unique interactive benefits – learn more.
Nowadays, with the development of mobile technology, wireless information has occupied the most important position in all kinds of information. On the other hand, wireless information has its own salient features, which is more different from traditional information, such as over-commixing, large amounts, susceptibility and isomerism. However, current information processing methods are not so suitable to process information with these properties.
Therefore, it is the right time to research novel information processing methods to deal with huge mobile information. Today, there are more remaining issues are waiting for solving, such as preprocessing and systemization of big mobile data, objective tracking and behavior understanding in Internet of Things, restoration and enhancement of mobile information, et al. All these entire problems need our more attention to solve.
In this way, this conference aims to provide an opportunity for researchers to publish their gifted theoretical and technological studies of the advanced methods in mobile information processing, and their novel engineering applications within this domain.
Welcome to the EAI Community
Let the EAI Community help you build your career with collaborative research, objective evaluation, and fair recognition:
- Get more visibility for your paper and receive a fair review with Community Review,
- Earn credits regardless of your paper’s acceptance and increase your EAI Index for new membership ranks and global recognition,
- Find out if your research resonates – get real-time evaluation of your presentation on-site via EAI Compass.
This year, the authors are invited to submit to one of the two parallel tracks. Both tracks are open for full submissions 10-20 pages, written according to the Springer format (see Author’s kit section).